Shengmei Semiconductor (ACM Research), which has technical innovation and complete product layout in the previous stage of semiconductors, held a product release conference at SEMICON TAIWAN 2025 on the 10th, and released the latest breakthroughs and future strategies in the advanced packaging field. Chairman Dr. Wang Xun pointed out that with the company's technical advantages, completion solutions and diversified product lines, the goal is to earn US$3 billion as soon as 2030.

In terms of crystal cleaning, Shengmei also has mature products, which specially provide a complete solution for large-size crystal cleaning; in the vertical furnace tube equipment part, the company continues to expand its customer base, and the products have been applied to many mainstream units in mainland China. Circuit manufacturing factory supports the application of semiconductor product processing such as logic, storage, special processes, etc., and atomic layer deposition furnace tube products have entered the advanced and following stages of logical circuits; in terms of semiconductor electromechanical equipment, Shengmei products cover the process from the previous stage. 28 nm, 14 nm and below technical points extend to advanced packaging, including TSV, 2.5D/3D packaging, and even can handle the electrical requirements of Group Three Five Compound Materials.

Dr. Wang Xun pointed out that compared to other companies, which may focus mainly on electric bulbs, cloths or shadows, Shengmei Semiconductors can provide the most complete combination of moisture processing equipment, whether CoWoS, 2.5D or 3D packaging, or it can be said that it is the most comprehensive company with global moisture equipment integration.

Optimistic about the FOPLP new opportunity under the AI ​​wave, Shengmei launches three panel-level packaging equipment

With the rapid development of AI technology, the size of AI chips has been increasing continuously, and the traditional 300mm circle is facing severe challenges in the advanced packaging process. Dr. Wang Xun explained that the biggest problem with CoWoS packaging using wafers is the waste of edge-corner materials. When a large crystal circle is planned to be divided into four to six pieces, the edge-corner parts are often not effectively utilized, which limits yield and production efficiency.

In contrast, panel-level packaging (PLP) uses square substrates, which can greatly improve effective utilization. According to industry estimates, relatively traditional crystal circles have more effective areas, which can continue to expand the size of AI chips, which is more cost-effective. Dr. Wang believes that panels are the only option to promote the development of larger-sized CoWoS and AI chips in the future.

International research organization Yole expects that from 2024 to 2030, the panel packaging market will grow rapidly with an average annual composite synthesis rate of 27%. Dr. Wang Xun bluntly stated that once Taiwan's electricity power achieves full production on 310 mm x310mm panels, it will further promote the advanced packaging demand of AI chips and open up a larger market space.

In order to meet the great demand for panel-level packaging, Shengmei Semiconductor has launched three core equipment, namely panel-level advanced packaging electroplate equipment, panel-level edge wetting etching equipment, and panel-level negative pressure welding agent cleaning equipment.

Among them, the negative pressure welding agent cleaning equipment has been put into the market. By evacuating the vacuum, the cleaning liquid can flow under the alternating action of vacuum and high air pressure, and can completely remove welding residues and other impurities in the middle, thereby achieving high efficiency and deep cleaning effect. Dr. Wang Xun pointed out that the equipment has been mass-produced by Chinese companies, and the cleaning effect is very clean and can quickly handle welding agents between GPU, HBM and other components to maintain structural integrity.

Individual horizontal rotational galvanizing technology to solve eight-year difficult problems in the industry

Then, Dr. Wang Xun reviewed the industry's history and stated that the industry currently uses vertical electric balls in panel-level packaging technology. For example, the solutions launched by Semsysco, Nexx, and Ebara are all vertical electric balls, and Shengmei Semiconductor is the world's first company to launch horizontal electric balls.

The traditional vertical ball inserts the crystal circle or panel vertically into the cylinder slot. As early as the 200mm round packaging period, vertical electric balls were generally adopted in the market, but after entering the 300mm era, horizontal electric balls became the mainstream, because the rotation of the substrate in the horizontal direction can greatly improve the uniformity of the electric balls, make thickness control more accurate, and greatly improve yield and production efficiency, which also helps to continue process management. Currently, NTD also fully adopts horizontal electric power technology in the CoWoS process.

Dr. Wang Xu pointed out that as the market develops towards larger panels, the industry has returned to using vertical balls because there are technical bottles in the use of horizontal balls, that is, when the square substrate rotates, the square balls cannot rotate simultaneously. This problem has plagued the industry for nearly seven or eight years and has never been broken.

After years of research and development, Shengmei semiconductor has successfully solved the problem of square panel rotating in square electric field in horizontal electric balls, allowing square panels to rotate smoothly and synchronously in horizontal electric balls. This breakthrough not only makes horizontal galvanized applications in panel-level advanced packaging, but also allows the company to win the 2025 technical innovation award from the 3D InCites Association of America.

Dr. Wang Xun pointed out that the breakthrough technology of "Flat Electric Field Rotation" not only becomes the company's core patent, but also makes Shengmei semiconductor a major supplier in the panel horizontal electric field.

Horizontal electric galvanized three core advantages, Shengmei semiconductors look forward to assisting CoPoS technology development

Talking about the advantages of horizontal electric balls, the first thing is to effectively reduce pollution, because in the horizontal electric balls, the panel is placed flat in the electric balls for copper. After the balls, it is cleaned first, and then the panel is transferred from the aluminum copper clamp to the aluminum clamp or aluminum silver clamp, which greatly reduces the cross-contamination between the aluminum clamps; second, the horizontal electric ball energy allows the square electrode to rotate, which helps improve the uniformity and efficiency of the aluminum clamps; finally, the horizontal electric ball is stable in energy performance, which is very suitable for CoWoS. Technology. Dr. Wang Xun pointed out that in the future, the development of CoWoS will rely almost entirely on horizontal electric ball technology. When converting directly from a CoWoS wafer to the panel-level process, it will be very difficult to return to the vertical electric ball. Therefore, horizontal electric ball is the best solution for CoWoS technology to the panel process and is also a core technology that must be mastered in the industry.

Dr. Wang Xun further emphasized that the square electrode rotation technology of Shengmei semiconductor has already provided key performance, can meet future needs, and is also confident that the electric galvanic characteristics of the square electrode can be equal to the circular electrode, realizing the unzipped connection of CoWoS crystalline to panel process.

Dr. Wang Ying expects that under the driving demand for AI chips, the FOPLP market has the opportunity to fly quickly. Currently, the company's panel-level packaging equipment supports two sizes, namely the 310×310mm driven by NTD and the 515×510mm used by other customers. The company will provide a complete solution for these two sizes. He also revealed that panel-level electric enclosure packaging equipment is currently in talks with customers about the first demo introduction, and other related equipment is also being actively promoted and ready to enter the global market.

Shengmei semiconductor targets are aimed at the top ten global companies, and plans to gradually expand the Taiwanese market

Looking forward to the future, Dr. Wang Xun hopes that products can enter the Taiwanese, American and European markets in large quantities, and gradually reach the top ten strong equipment companies in the world. He also reiterated that the goal is to earn about $3 billion this year.

Dr. Wang Xun said that Shengmei semiconductors have set up sales and service centers in the United States, Europe, South Korea and Southeast Asia, and will accelerate globalization in the future. At the same time, the company's differentiated and original products developed will continue to provide long-term value to global semiconductor customers.

As AI chips have a demand for advanced technologies continue to increase in the next five to ten years, many of the equipment and material technologies required for AI chips in the future are still in the R&D stage, which brings huge market opportunities to companies with innovative capabilities. Shengmei semiconductor will not only deepen its roots in the Chinese market, but will also actively expand its American business, and plan to establish a research and development and production base in Taiwan in the future, bringing core technologies and innovation capabilities to Taiwan.

"Taiwan is a very important market, especially in the advanced chip manufacturing field." Dr. Wang Xun said that Taiwan Electric's recent information is amazing. As a equipment supplier, we look forward to making contributions to the manufacturing of Taiwan Electric's next-generation AI chip panel packaging through its own differentiated level electric products. This is also the starting point of Shengmei Semiconductor's market in the Taiwan market.

Extended reading: With the support of innovative differentiation technology, Shengmei semiconductor displays the complete product line energy of seven large panels